Job Details

Hardware Engineering Manager – Semiconductor Test Platform (Teradyne, Agoura Hills, CA)

Date: Oct 27, 2025

Location: Agoura Hills, CA, US

We are the global test and automation specialists, powering next‑generation technologies through sophisticated solutions. Behind every electronic device you use, Teradyne's test technology ensures your device works right the first time, every time! Our portfolio of automation solutions helps manufacturers to develop and deliver products quickly, efficiently and cost‑effectively. Together, Teradyne companies deliver manufacturing automation across industries and applications around the world!

We attract, develop, and retain a high‑performance workforce, comprised of people with diverse backgrounds and a shared drive for excellence. We strive to foster a positive and inclusive work environment that helps employees and communities thrive.

Our Purpose

TERADYNE, where experience meets innovation and driving excellence in every connection. We are fueled by creativity and diversity of thought in our workforce. Our employees are supported to innovate and learn something new every day.

We cultivate a culture of inclusion for all employees that respects their individual strengths, views, and experiences. We believe that our differences enable us to be a better team – one that makes better decisions, drives innovation and delivers better business results.

Opportunity Overview

We are seeking a strategic and technically adept senior leader to drive the execution of semiconductor test platform programs. This role requires deep experience in test cell architecture, cross‑functional team leadership, and a strong understanding of both wafer‑level and packaged device testing. The ideal candidate will have a proven track record of delivering integrated test solutions that span mechanical, electrical, software, firmware, and signal delivery domains.

• Lead the full lifecycle of semiconductor test platform projects—from concept through deployment.
• Manage and align cross‑functional engineering teams, including:
  • Mechanical Engineering: Enclosure, thermal, and structural integration.
  • Electrical Engineering: PCB layout, power delivery, and signal integrity.
  • Software Engineering: Test automation frameworks, data analytics, and user interfaces.
  • Firmware Development: Embedded systems, instrumentation control, and real‑time processing.
  • Signal Delivery Design: High‑speed interconnects, probing technologies, and test interface hardware.
• Oversee semiconductor test cell integration, including handler interfaces, thermal control systems, and automation workflows.
• Drive platform development for wafer‑level and packaged device testing, ensuring optimal performance and reliability.
• Collaborate with probe card designers and probing technology experts to deliver high‑precision, high‑yield probe solutions.
• Partner with internal stakeholders and customers to define requirements and ensure successful platform adoption.
• Develop and manage detailed project plans, track milestones, and mitigate risks.
• Build and mentor a high‑performing team of program managers and technical leads.
• Provide regular updates to senior leadership on program status, risks, and strategic decisions.

All About You

We seek individuals who share our passion and determination. Our commitment to customer success drives us to go the extra mile. If you're ready to join us in this mission, take a closer look at the minimum criteria for the position.

• Bachelor's or Master's degree in Electrical, Mechanical, or Computer Engineering.
• 10+ years of experience in semiconductor test systems, with 5+ years in a leadership role.
• Proven success in leading multidisciplinary engineering teams and delivering complex test platforms.
• Deep understanding of ATE systems, test methodologies, and semiconductor manufacturing processes.
• Strong organizational, communication, and strategic planning skills.

Preferred Experience

• Semiconductor test cell architecture and integration.
• Wafer‑level and packaged device testing, including probe card and socket technologies.
• Probe solutions for advanced nodes and high‑density interconnects.
• High‑speed signal integrity and test interface design.
• Collaboration with global teams and external suppliers.
• Familiarity with compliance, reliability, and environmental testing standards.

This position is not eligible for visa sponsorship.

Compensation: The base salary range for this role is $180,300–$288,500. This range is a good faith estimate, and the amount of base salary will correspond with experience and skill set. This range can also fluctuate depending on demand and location.

Incentive Plan: This job is eligible for discretionary bonus(es) based on financial performance.

Teradyne offers a variety of robust health and well‑being benefit programs, including medical, dental, vision, Flexible Spending Accounts, retirement savings plans, life and disability insurance, paid vacation & holidays, tuition assistance programs, and more. Please click here to see details.